8 mirefy SiC Production kilasy wafer 4H-N SiC substrate
Ity tabilao manaraka ity dia mampiseho ny mari-pamantarana ny 8inch SiC wafers:
| 8 mirefy N-karazana SiC DSP Specs | |||||
| isa | zavatra | Unit | Famokarana | Research | Dummy | 
| 1: parametra | |||||
| 1.1 | polytype | -- | 4H | 4H | 4H | 
| 1.2 | orientation ambonin'ny tany | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 | 
| 2: Parameter elektrika | |||||
| 2.1 | dopant | -- | n-karazana azota | n-karazana azota | n-karazana azota | 
| 2.2 | resistivity | ohm ·cm | 0.015~0.025 | 0.01~0.03 | NA | 
| 3: Parameter mekanika | |||||
| 3.1 | savaivony | mm | 200±0.2 | 200±0.2 | 200±0.2 | 
| 3.2 | hateviny | μm | 500±25 | 500±25 | 500±25 | 
| 3.3 | Orientation notch | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 | 
| 3.4 | Notch Depth | mm | 1~1.5 | 1~1.5 | 1~1.5 | 
| 3.5 | LTV | μm | ≤5(10mm * 10mm) | ≤5(10mm * 10mm) | ≤10(10mm * 10mm) | 
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 | 
| 3.7 | LOHAN-TSAMBO | μm | -25~25 | -45~45 | -65~65 | 
| 3.8 | aretina | μm | ≤30 | ≤50 | ≤70 | 
| 3.9 | afm ny | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 | 
| 4: Rafitra | |||||
| 4.1 | hakitroky micropipe | ea/cm2 | ≤2 | ≤10 | ≤50 | 
| 4.2 | votoaty metaly | atôma/cm2 | ≤1E11 | ≤1E11 | NA | 
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA | 
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA | 
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA | 
| 5. kalitao eo anoloana | |||||
| 5.1 | anoloana | -- | Si | Si | Si | 
| 5.2 | ambonin`ny farany | -- | Si-face CMP | Si-face CMP | Si-face CMP | 
| 5.3 | sombiny | ea/wafer | ≤100 (habe≥0.3μm) | NA | NA | 
| 5.4 | rangotra, ratra kely | ea/wafer | ≤5, Total Length≤200mm | NA | NA | 
| 5.5 | sisin'ny chips / indents / triatra / tasy / loto | -- | tsy misy | tsy misy | NA | 
| 5.6 | faritra polytype | -- | tsy misy | Faritra ≤10% | Faritra ≤30% | 
| 5.7 | marika eo anoloana | -- | tsy misy | tsy misy | tsy misy | 
| 6: kalitao miverina | |||||
| 6.1 | aoriana farany | -- | C-face MP | C-face MP | C-face MP | 
| 6.2 | rangotra, ratra kely | mm | NA | NA | NA | 
| 6.3 | Sisiny lamosina chips / indents | -- | tsy misy | tsy misy | NA | 
| 6.4 | Ny henjana lamosina | nm | Ra≤5 | Ra≤5 | Ra≤5 | 
| 6.5 | Fanamarihana lamosina | -- | Notch | Notch | Notch | 
| 7: zohy | |||||
| 7.1 | sisin'ny | -- | Chamfer | Chamfer | Chamfer | 
| 8: Fonosana | |||||
| 8.1 | fonosana | -- | Epi-vonona amin'ny banga fonosana | Epi-vonona amin'ny banga fonosana | Epi-vonona amin'ny banga fonosana | 
| 8.2 | fonosana | -- | Multi-wafer fonosana kasety | Multi-wafer fonosana kasety | Multi-wafer fonosana kasety | 
Diagram amin'ny antsipiriany
 
 		     			 
 		     			 
 		     			Vokatra mifandraika
Soraty eto ny hafatrao ary alefaso aminay
 
                 


